0.8mm Pitch High-Density Female Board-to-Board Connectors - Segmented SMT Mezzanine Receptacle-ELETE | Professional Connector Manufacturer

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0.8mm Pitch High-Density Female Board-to-Board Connectors - Segmented SMT Mezzanine Receptacle

Multi-Pin SMT PCB Stacking Socket with Phosphor Bronze Contacts & UL 94V-0 LCP Housing for Telecom and Server Motherboards

BFEDM-80P013

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BFEDM-80P013

Serial Number：BFEDM-80P013

Connector & Cable

Board to board connector

High speed Connectors

Board to Board Connector

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Engineered for high-speed data transmission and high-count signal routing, BFEDM-80P013 is a 0.8mm pitch female board-to-board connector featuring a robust segmented design that ensures impeccable coplanarity and reliable multi-channel docking.

Feature	Specification
Model	BFEDM-80P013
Pitch	0.8mm(0.031'')
Gender	Female / Receptacle
Number of Pins	80 Pin (Standard shown, available in 40, 80, 120, 160, 200 Pins)
Operating Temperature	-40℃ to +105℃
Contact Material	Brass / Phosphor Bronze
Insulation Material	High-temp Polyester,UL94V-0 LCP/NL6T/PA9T
·All materials are RoHS and REACH compliant. Halogen-free options are available.

Key Features & Advantage:

Anti-Warping Segmented Structure: The elongated housing is cleverly divided into three segments (multi-bay layout). This reduces plastic thermal expansion/contraction warpage during baking and ensures exceptional terminal coplanarity.
Massive Multi-Pin Capability: Supports ultra-high pin counts up to 200 positions within a compact 0.8mm pitch architecture, perfect for streamlining multi-lane PCIe, data bus, or motherboard-to-backplane routing.
Heavy-Duty Contact Reliability: Fitted with high-tensile phosphor bronze female terminals, offering a wider contact surface and enhanced retention to prevent intermittent signal drops caused by severe shocks.
Industrial Reflow Process Optimization: Formed with standard UL 94V-0 LCP high-temperature plastic, it handles demanding lead-free reflow heating cycles seamlessly and includes mounting pegs for automated pick-and-place precision.

Drawing

Classic Applications

Servers, Data Centers & Storage Arrays: Ideal for linking processor boards to memory expansion daughter cards, storage controllers, or network interface backplanes.
Telecommunication Base Stations: High-speed data bridging between main processing modules and RF amplification board stacks.
Industrial PCs (IPC) & Automation Controls: High-density I/O routing for modular industrial computers, PLCs, and complex robotics motherboards.
Advanced Driver Assistance Systems (ADAS) Computers: Interconnecting multi-camera processing boards and GPU/CPU computing modules in autonomous vehicle servers.