0.8mm Pitch High-Density Male Board-to-Board Connectors - Segmented SMT Mezzanine Plug-ELETE | Professional Connector Manufacturer

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0.8mm Pitch High-Density Male Board-to-Board Connectors - Segmented SMT Mezzanine Plug

Multi-Pin SMT PCB Stacking Male Connector with Phosphor Bronze Contacts & High-Temperature LCP Body for Telecom & Industrial Computing

BMEDM-80P013

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BMEDM-80P013

Serial Number：BMEDM-80P013

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Board to board connector

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Designed as the perfect matching plug for BFEDM female series, BMEDM-80P013 is a 0.8mm pitch male board-to-board connector that leverages a unique segmented multi-bay architecture to deliver superior co-planarity and secure high-pin-count interconnection.

Feature	Specification
Model	BMEDM-80P013
Pitch	0.8mm(0.031'')
Gender	Male / Plug
Number of Pins	80 Pin (Standard shown, configurable in 40, 80, 120, 160, 200 Pins)
Operating Temperature	-40℃ to +105℃
Contact Material	Brass / Phosphor Bronze
Insulation Material	High-temp Polyester,UL94V-0 LCP/NL6T/PA9T
·All materials are RoHS and REACH compliant. Halogen-free options are available.

Key Features & Advantage:

Seamless Male-Female Synergy: Engineered to pair seamlessly with ELETE’s BFEDM female series, ensuring balanced insertion/extraction forces and maintaining low contact resistance across all pins.
Segmented Anti-Warp Shield: The structured multi-bay layout mirrors the female receptor, controlling potential SMT thermal expansion stress and guaranteeing that all terminal feet sit perfectly within a strict $\le 0.10\text{mm}$ coplanarity standard.
Robust Gold-Plated Contacts: High-grade phosphor bronze male blades feature a dual-option plating (Gold/Tin) that effectively withstands mechanical wear and atmospheric oxidation during multi-cycle maintenance stacking.
Optimized for High-Speed Pick-and-Place: Features integral rigid mounting pegs and flat surfaces optimized for vacuum nozzles, allowing zero-defect automated alignment during high-speed SMT assembly.

Drawing

Classic Applications

High-Performance Servers & RAID Controllers: Connecting central processing architectures to high-speed PCIe expansion slots, array cards, and storage backplanes.
Telecommunications Switching Systems: Facilitates reliable board stacking within 5G routers, optical network terminals, and cellular base station computing racks.
Industrial Automation & PLC Modules: Establishes solid multi-channel data paths in high-end modular programmable logic controllers (PLCs) and CNC machines.
Automotive Intelligent Compute Platforms (IVIs/ADAS): Serves as the central link bridging graphic processing daughterboards to the vehicle's main computing motherboard.