0.8x1.2mm (0.031" x 0.047") Pitch Female Header Dual Rows SMT Type | ELETE HFFDM30-Series-ELETE | Professional Connector Manufacturer

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0.8x1.2mm (0.031" x 0.047") Pitch Female Header Dual Rows SMT Type | ELETE HFFDM30-Series

High-Precision Low-Profile Dual-Row Female Header for Compact High-Density SMT PCB Interconnection

HFFDM30-P001

❌️

HFFDM30-P001

Serial Number：HFFDM30-P001

Connector & Cable

Board to board connector

Female Header

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A compact and robust 0.80mm x 1.20mm pitch dual-row female header designed for stable, high-density SMT PCB interconnections in space-limited electronic devices.

Feature	Specification
Model	HFFDM30-A001
Gender	Female
Pitch	0.8mm 0.31''
Mounting Type	SMT (Surface Mount Technology)
Row	Double/Dual
Current Rating	0.5 Ampere
Insulation Resistance	500MΩ Min
Dielectric Withstanding	200V AC
Contact Resistance	20mΩ Max
Terminal Material	Brass / Phosphor Bronze
Insulation Material	High-Temperature Polyester (UL 94V-0), LCP / NL6T/PA9T options
Operating Temperature	-40°C to +105°C
Plating Options	Gold Flash / Gold 3U" /Gold 10U" /Gold Flash + Tin / Select Plating
Packaging Methods	Tube/Reel Package
Compliance	RoHS & REACH Compliant, Halogen-Free available
Suggested Mating Pin LENGTH	1.4~2.8mm
·All materials are RoHS and REACH compliant. Halogen-free options are available.

Key Features & Advantages

Ultra-Fine Pitch & High Density: With a 0.80mm pin-to-pin pitch and 1.20mm row spacing, it maximizes PCB real estate efficiency, supporting up to 100 pins (50 pins per row) for multi-channel data configurations.

Precision 0.30mm SQ Pin Technology: Uses ultra-thin 0.30mm square pins to ensure stable low-current signal integrity (0.5A Max) and low contact resistance.

Optimized SMT Coplanarity: Engineered with a strict coplanarity control of 0.10mm Max, guaranteeing excellent solder paste contact and high yields during automated reflow soldering.

Premium High-Temperature Housing: Molded with LCP or NL6T (UL 94V-0), providing outstanding dimensional stability and heat resistance required for modern lead-free SMT processes.

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