1.27mm × 2.54mm Pitch SMT Female Header - Dual Row Bottom Contact Pass-Through Socket Connector-ELETE | Professional Connector Manufacturer

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1.27mm × 2.54mm Pitch SMT Female Header - Dual Row Bottom Contact Pass-Through Socket Connector

2.00mm Ultra-Thin Hybrid Pitch PCB Receptacle, 1.0A Phosphor Bronze Bottom-Entry Contacts, Optimized for Automated High-Speed Tape & Reel Assembly

HFJDM22-A001

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HFJDM22-A001

Serial Number：HFJDM22-A001

Connector & Cable

Board to board connector

Female Header

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Combining a space-saving 1.27x2.54mm hybrid pitch with an ultra-low 2.00mm profile, the HFJDM22 series delivers secure bottom-entry mating and features a pre-installed Mylar cap for seamless high-speed robotic pick-and-place workflow.

Low profile design, HFIDM22-A001 series features a peg-free, completely flat SMT base paired with dual-entry bottom contacts to achieve high-density parallel board-to-board bridging.

Feature	Specification
Model	HFJDM22-A001
Pitch	1.27mm(0.05'')*2.54mm(0.1'')
Gender	Female Header
Rows	Dual Row, 03 to 40 Positions per row
Mounting Features	Bottom Contact / Pass-Through
Current Rating	1 Ampere
Insulation Resistance	1000MΩ Min
Dielectric Withstanding	600V AC
Contact Resistance	20mΩ Max
Operating Temperature	-40℃ to +105℃
Contact Material	Brass / Phosphor Bronze
Insulation Material	High-temp Polyester,UL94V-0 LCP/NL6T/PA9T
·All materials are RoHS and REACH compliant. Halogen-free options are available.

Key Features & Advantage:

Unique 1.27 × 2.54mm Hybrid Geometry: By opening the row-to-row spacing to 2.54mm while maintaining a micro 1.27mm pin layout, it offers expanded space for trace routing between pads on the PCB and minimizes cross-talk or short-circuit risks in dense multi-signal layouts.
Ultra-Thin 2.00mm Silhouette: Shaving the vertical height down to just 2.00mm, this connector is an exceptional fit for thin sandwich-structured electronics, pushing the boundaries of miniaturized stack hardware.
Reflow-Ready Automated Pick-and-Place: Equipped with a specialized high-temperature Mylar pad, the connector allows standard vacuum nozzles to pick and mount seamlessly from Tape & Reel packaging, ensuring zero tipping and maximal factory placement yield.
Pass-Through Bottom-Entry Agility: Like its sister series, its gold-plated phosphor bronze jaws accept pins pushed from the backside of the board, allowing creative dual-sided inverted daughtercard integration.

Drawing

Classic Applications

Automotive Infotainment & HUD Systems: Interconnecting logic control boards to display matrices through the board bottom, where automated high-speed high-yield SMT assembly is strictly required.
High-End Telecom Communications & Routers: Linking parallel optical transceiver sub-modules to the mother router circuit board.
Mass-Produced Smart Home Appliances: Perfect for high-volume automated electronic assembly tracks manufacturing smart thermostat modules and IoT touch panels.
Industrial PLC & Servo Drive Controllers: Safely bridging complex MCU brains to bottom-layer signal isolation layers using the wider 2.54mm row safety clearance.