1.27mm Pitch SMT Female Header Connector - Dual Row Bottom Contact Surface Mount Socket-ELETE | Professional Connector Manufacturer

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1.27mm Pitch SMT Female Header Connector - Dual Row Bottom Contact Surface Mount Socket

1.0A Micro-Pitch Bottom-Entry PCB Pass-Through Receptacle, Featuring High-Temperature LCP/NL6T Housing & Halogen-Free Materials

HFIDM22-P001

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HFIDM22-P001

Serial Number：HFIDM22-P001

Connector & Cable

Board to board connector

Female Header

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Engineered for ultra-compact and multi-dimensional hardware routing, HFIDM22-P001 series is a 1.27mm micro-pitch SMT female header that supports versatile bottom-entry mating to optimize dual-sided board space.

Feature	Specification
Model	HFIDM22-P001
Pitch	1.27mm(0.05'')
Gender	Female Header
Rows	Dual Row, 03 to 40 Positions per row
Mounting Type	SMT Female Header with Bottom Contact
Current Rating	1 Ampere
Insulation Resistance	1000MΩ Min
Dielectric Withstanding	600V AC
Contact Resistance	20mΩ Max
Operating Temperature	-40℃ to +105℃
Contact Material	Brass / Phosphor Bronze
Insulation Material	High-temp Polyester,UL94V-0 LCP/NL6T/PA9T
·All materials are RoHS and REACH compliant. Halogen-free options are available.

Key Features & Advantage:

Innovative Bottom-Entry/Pass-Through Design: The bottom-contact architecture allows mating pins to enter from the underside of the PCB via drilled holes. This unlocks revolutionary multi-board configurations and eliminates the need for expensive tall connectors.
Ultra-Low Profile 2.20mm Body: With a miniature body height of just 2.20mm, this connector is purpose-built to sit inside tight device enclosures where mezzanine height and component density are heavily restricted.

Drawing

Classic Applications

Smart Metering & IoT Sensor Hubs: Connecting sensor expansion daughterboards to the main processing unit from the back of the board to reduce total stacking volume.
High-Density LED Display Control Arrays: Ideal for sandwich-style cascading multi-layered driver boards where signal lines must pass through from the bottom of neighboring modules.
Miniaturized Embedded Compute Cards (PC104 / Micro-VME): Creating secure pass-through parallel data buses across vertically stacked embedded hardware systems.
Industrial Automation & Drive Inverters: Bridging signal isolation barriers inside high-density motor driver modules and compact robotic control units.