1.27mm SMT Female Header - Dual Row Bottom Entry Pass-Through Socket-ELETE | Professional Connector Manufacturer

Language

Quote Now

产品管理

全部
产品管理
新闻资讯
介绍内容
企业网点
常见问题
企业视频
企业图册

Home

1.27mm SMT Female Header - Dual Row Bottom Entry Pass-Through Socket

Low Profile Dual-Row PCB Receptacle, Peg-Free Design for Flexible SMT Assembly

HFIDM22-A001

❌️

HFIDM22-A001

Serial Number：HFIDM22-A001

Connector & Cable

Board to board connector

Female Header

Related Products

Now Inquire

Low profile design, HFIDM22-A001 series features a peg-free, completely flat SMT base paired with dual-entry bottom contacts to achieve high-density parallel board-to-board bridging.

Feature	Specification
Model	HFIDM22-A001
Pitch	1.27mm(0.05'')
Gender	Female Header
Rows	Dual Row, 03 to 40 Positions per row
Mounting Type	Bottom Contact / Top Entry Dual-Mode
Current Rating	1 Ampere
Insulation Resistance	1000MΩ Min
Dielectric Withstanding	600V AC
Contact Resistance	20mΩ Max
Operating Temperature	-40℃ to +105℃
Contact Material	Brass / Phosphor Bronze
Insulation Material	High-temp Polyester,UL94V-0 LCP/NL6T/PA9T
·All materials are RoHS and REACH compliant. Halogen-free options are available.

Key Features & Advantage:

Peg-Free Flat SMT Design: Without plastic locating pegs beneath the insulator base, this connector eliminates the need for precision alignment holes on the PCB, freeing up underlying layer routing tracks and simplifying board drilling layouts.
Ultimate 2.15mm Clearance Slimming: Specially trimmed to a 2.15mm profile, it allows developers to compress multi-layer PCB sandwiches together with unparalleled narrow spacing, perfect for slim handheld electronics.
Dual-Entry Pass-Through Agility: Features the iconic bottom-contact design that accepts male headers passing through the PCB from the reverse side, supporting intricate, multi-level blind mating architectures.
Flawless Automated Coplanarity : Every component features a uniform 0.15mm coplanarity line across all SMT leads, preventing soldering open-circuits and ensuring excellent yield rates during automated high-speed Pick-and-Place workflows.

Drawing

Classic Applications

Smart Metering & IoT Sensor Hubs: Connecting sensor expansion daughterboards to the main processing unit from the back of the board to reduce total stacking volume.
High-Density LED Display Control Arrays: Ideal for sandwich-style cascading multi-layered driver boards where signal lines must pass through from the bottom of neighboring modules.
Miniaturized Embedded Compute Cards (PC104 / Micro-VME): Creating secure pass-through parallel data buses across vertically stacked embedded hardware systems.
Industrial Automation & Drive Inverters: Bridging signal isolation barriers inside high-density motor driver modules and compact robotic control units.