1.8mm (0.071") Pitch SMT Male Header with Flat Pin for Automotive Connector | ELETE HM2SV18-P001
Single-Row Surface Mount Pin Header, High-Temperature Automotive Grade Interconnect, RoHS & REACH Compliant
HM2SV18-P001
Serial Number:HM2SV18-P001
Optimized for space-constrained automotive electronics, this 1.8mm pitch single-row SMT male header features custom flat pins and robust high-temperature materials (LCP/PA9T) for secure PCB coplanarity and reliable performance.
| Feature | Specification |
|---|---|
| Pitch | 1.8mm(0.071'') |
| Gender | Male Header |
| Rows | Single Row |
| Mounting Type | SMT (Surface Mount Technology) |
| Pin Type | Flat Pin |
| Current Rating | 3 Ampere |
| Insulation Resistance | 1000MΩ Min |
| Dielectric Withstanding | 600V AC |
| Contact Resistance | 20mΩ Max |
| Coplanarity | 0.12mm Max |
| Operating Temperature | -40℃ to +105℃ |
| Contact Material | Brass / Phosphor Bronze |
| Insulation Material | High-temp Polyester,UL94V-0 LCP/NL6T/PA9T |
| ·All materials are RoHS and REACH compliant. Halogen-free options are available. | |
Key Features & Advantage:
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Space-Saving Single-Row Design: Ideal for high-density automotive PCBs where space is premium, providing a reliable and low-profile interconnect solution.
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Premium Material for Reflow Soldering: Utilizing advanced insulation materials like LCP, PA9T, and NL6T (UL 94V-0), perfectly withstanding standard lead-free reflow soldering processes.
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Precision Flat Pin Technology: Designed with special flat pins for automotive mating connectors, reducing wear and maintaining lower contact resistance.
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Excellent Coplanarity: Tight SMT tail coplanarity control 0.12mm ensures automated pick-and-place precision and faultless soldering yields.
Drawing

Classic Applications
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Automotive Control Systems: Body Control Modules (BCM), smart keyless entry receivers, and steering wheel sensor controls.
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EV Battery Management: Voltage monitoring lines in Battery Management Systems (BMS) requiring strict pitch precision.
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Compact Industrial Modules: Miniature industrial cameras, automated sensors, and IoT gateways where space for connectors is limited.
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