2.54mm Pitch Board Spacer Dual Rows Straight DIP Type | ELETE HMNDSH Series-ELETE | Professional Connector Manufacturer

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2.54mm Pitch Board Spacer Dual Rows Straight DIP Type | ELETE HMNDSH Series

Double Plastic Body Mezzanine Stacking Headers with Adjustable Board Spacing

HMNDSH25-A001

❌️

HMNDSH25-A001

Serial Number：HMNDSH25-A001

Connector & Cable

Board to board connector

Male Header

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A versatile 2.54mm pitch dual-row through-hole stacking header designed with dual insulator bases, providing customizable board-to-board spacing and rigid structural support for parallel PCB architectures.

Feature	Specification
Model	HMNDSH25-A001
Pitch	2.54 mm / 0.1 inch / 0.1"
Gender	Male Header, Pin Header
Rows	Double/Dual
Insulator Height	1.50mm, 2.54mm
Structure	Dual Insulator Bases
Number of Pins	2 to 40 Pins per Row
Mounting Type	DIP Type / Through-Hole
Current Rating	3 A, 4A, 5A or as required
Insulation Resistance	1000MΩ Min
Dielectric Withstanding	600V AC
Contact Resistance	20mΩ Max
Operating Temperature	-40℃ to +105℃
Contact Material	Brass / Phosphor Bronze
Insulation Material	High-temp Polyester,UL94V-0 LCP/NL6T/PA9T
·All materials are RoHS and REACH compliant. Halogen-free options are available.

Key Features & Advantage:

Dual-Insulator Body Design: Features two distinct plastic housings that lock the pins in perfect alignment. The lower body rests on the host PCB, while the upper body provides a clean mechanical rest and exact alignment for the mating board or socket.
Fully Customizable Stacking Height: The center window dimension (H) is fully variable upon order. This allows engineers to fine-tune the clearance between parallel PCBs to avoid components of various heights.
High Pin Density: Utilizes standard 2.54* 2.54mm grid to route dense rows of power and data signals across mezzanine board configurations.
Mating Ecosystem: Perfectly matches ELETE's extensive through-hole and SMT female socket lines (e.g., HFNDSH8YP, HFNDS68, HFNDM8Y, HFNDM11 and more).

Drawing

Classic Applications

This dual-body board spacer pin header is universally utilized in layered, multi-board hardware architectures (Mezzanine or Sandwich structures) where parallel PCBs require fixed physical spacing and multi-channel signal routing:

Industrial Controls & Automation: Heavy-duty PLC module stacking, motor drive control units, and industrial mainboards layered with I/O cards. The dual plastic housing absorbs high-vibration stress.
Power Supplies & Energy Systems: Stacking control boards over power stages in solar inverters, battery management systems (BMS), and smart grid power distribution modules. The customizable height (H) allows clearance for tall transformers, large capacitors, and heat sinks.
Telecommunications & Networking: Mezzanine daughter-cards within high-speed routers, server blade systems, wireless base stations, and backplanes requiring optimal thermal airflow channels between stacked boards.
Automotive Electronics: Double-stacked PCB subsystems inside vehicle infotainment units, body control modules (BCM), and electric vehicle (EV) charging control pillars.
Test & Measurement Instrumentation: Diagnostic hardware chassis, laboratory oscilloscope mainboards, and modular test rigs where auxiliary sensor boards stack above the primary processing unit.