2.54mm Pitch Bottom Entry Dual Row Female Header, DIP Type PCB Connector, HFNDT50 Series-ELETE | Professional Connector Manufacturer

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2.54mm Pitch Bottom Entry Dual Row Female Header, DIP Type PCB Connector, HFNDT50 Series

Double-Row Vertical Bottom Entry DIP Female Socket, 5.0mm Housing Height for Pass-Through Board Stacking

HFNDT50-A002

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HFNDT50-A002

Serial Number：HFNDT50-A002

Connector & Cable

Board to board connector

Female Header

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A specialty 2.54mm pitch dual-row vertical DIP female header featuring a unique bottom-entry design, enabling male pins to insert through the underside of the PCB for low-profile pass-through board stacking.

Feature	Specification
Model	HFNDT50-A002
Pitch	2.54 mm / 0.1 inch / 0.1"
Gender	Female Header, Socket Header, Receptacle
Rows	Dual Rows
Entry Type	Bottom Entry Type
Insulator Height	5.0mm
Number of Pins	2 to 40 Pins per Row
Mounting Type	Surface Mount Technology(SMT)
Current Rating	3 A, 4A, 5A or as required
Insulation Resistance	1000MΩ Min
Dielectric Withstanding	600V AC
Contact Resistance	20mΩ Max
Operating Temperature	-40℃ to +105℃
Contact Material	Brass / Phosphor Bronze
Insulation Material	High-temp Polyester,UL94V-0 LCP/NL6T/PA9T
Suggested Mating Pin Length	3.0mm to 4.5mm
·All materials are RoHS and REACH compliant. Halogen-free options are available.

Key Features & Advantage

Unique Bottom Entry Configuration: Specifically engineered to allow mating pins to enter from the bottom face of the PCB. This design facilitates pass-through stacking configurations, optimizing vertical space across multiple circuit boards.
Slim 5.0mm Profile: The 5.0mm housing height keeps the board distance compact while maintaining a rigid through-hole connection.
Premium Phosphor Bronze Contacts: Provides excellent spring retention and superior fatigue resistance, ensuring uniform contact pressure over long-term usage.
High Pin Density: Supports up to 80 contacts on a standard 2.54mm grid array, handling multiple power and signal paths efficiently.
Excellent Thermal Durability: Available with high-temperature T-NL6T or LCP insulators, fully protecting the component body during harsh industrial wave or reflow soldering processes.

Drawing

Classic Applications

Pass-Through Multi-Board Stacking: Sandwich-style PCB architectures, parallel daughtercard connections, and multi-tier embedded modules.
Industrial Controls & PLCs: Compact modular control systems and expansion boards where input signals mate from underneath the mainboard.
Telecommunications & Computing: Multi-layer router logic systems, server interface expansion panels, and backplane architectures.
Power Electronics: Smart electricity meters, inverter power supply distribution blocks, and test instrumentation.
Automotive Sub-Systems: Embedded dashboard clusters and sensory adapter modules requiring reverse mating.