2.54mm Pitch Dual Row Double Press-Fit Male Header Connector-ELETE | Professional Connector Manufacturer

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2.54mm Pitch Dual Row Double Press-Fit Male Header Connector

Dual-Sided Solderless Interconnect for Mezzanine Board-to-Board Stacking

HMNDS60-Y001

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HMNDS60-Y001

Serial Number：HMNDS60-Y001

Press-Fit Connector

Press Fit connectors

Connector & Cable

Board to board connector

Male Header

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A unique dual-row 2.54mm pitch male header engineered with compliant press-fit pins on both ends to enable seamless, solderless parallel stacking of two PCBs with ultimate mechanical stability.

Feature	Specification
Pitch	2.54 mm / 0.1 inch / 0.1"
Rows	Dual Row/Double Row
Orientation	Through-Hole, Straight Male Header
Interface Style	Double-Ended Press-Fit / Dual Press-Fit
Current Rating	3A,4A or as required
Contact Resistance	20mΩ Max
Insulation Resistance	1000MQ Min
Dielectric Withstanding	600V AC
Operating Temp	-40℃ to +105℃
Housing Material	UL94V-0(LCP/PA9T/PA6T)
Contact Material	Brass, Phosphor Bronze(Gold or Tn Plating)
Available Pins	2 - 40 Pins Per Row / Up to 80 Pins total
·All materials are RoHS and REACH compliant. Halogen-free options are available.

Key Features & Advantages

Dual-Sided Press-Fit Technology: Featuring compliant eye-of-the-needle pins on both upper and lower sections, allowing both mating PCBs to be mechanically pressed into place, eliminating 100% of the soldering iron/reflow heat processes.
Solderless Mezzanine Interconnect: Ideal for sandwiched board architectures, providing a permanent gas-tight connection that is resilient to high vibration and thermal expansion mismatch.
Robust Material Engineering: Built with high-conductivity Brass contacts and rugged, flame-retardant insulators supporting options like PBT, NL6T, LCP, or PA9T (UL 94V-0 rated).
High Pin-Count Availability: Supports single-row pin layouts from 2 to 40 pins (up to 80 pins per connector total), accommodating complex multi-line logic and power distributions between boards.

Drawing

Classic Applications

Multi-Layer PCB Stacking & Sandwiched Boards: Perfect for stacking sensor arrays, power driver cards, or storage expansions directly onto a main motherboard in a vertical sandwich layout.
Aerospace & Satellite Avionics: Used in compact flight control computers and CubeSats where soldering weight is restricted and connections must withstand harsh launch vibrations.
Heavy Industrial Inverters & Power Supplies: Linking control logic boards vertically to high-power semiconductor boards while maintaining isolative board spacing.
Automotive EV Battery Management: Joining modular battery cell monitoring sub-boards to the primary computing module securely without creating thermal hazards next to cells.
Railway & Infrastructure Telematics: Rugged on-board signaling computing racks where solder fatiguing from constant operational vibrations must be fully avoided.