2.54mm Pitch Dual Row Elevated Pin Header with 4.3mm Base | ELETE HMNDS43 Series

Through-Hole Double Row Stacking Headers with 4.3mm Increased Base Height for Component Clearance

A high-durability 2.54mm pitch dual-row through-hole pin header featuring an elevated 4.3mm insulator base, engineered to provide perfect clearance and secure vertical spacing between stacked PCBs.

Feature Specification
Model HMNDS43-A001
Pitch  2.54 mm / 0.1 inch / 0.1"
Gender Male Header, Pin Header
Rows Double/Dual
Insulator Height 4.30mm
Number of Pins 2 to 40 Pins per Row
Mounting Type DIP Type / Through-Hole
Current Rating 3 A, 4A, 5A or as required
Insulation Resistance 1000MΩ Min
Dielectric Withstanding 600V AC
Contact Resistance 20mΩ Max
Operating Temperature -40℃ to +105℃
Contact Material Brass / Phosphor Bronze
Insulation Material High-temp Polyester,UL94V-0 LCP/NL6T/PA9T
·All materials are RoHS and REACH compliant. Halogen-free options are available.

 

Key Features & Advantage:

  • Elevated 4.3mm Base Design: The specialized 4.30mm tall plastic housing functions as an integrated standoff, delivering crucial physical clearance between parallel PCBs to safeguard taller surface-mount components from short circuits.

  • Dual-Row High Density: Combines the dual-row matrix design with standard 2.54mm spacing, optimizing multi-signal routing while maintaining high mechanical rigidity.

  • Rugged Through-Hole Mounting: The DIP pins anchor securely into the PCB holes, providing premium solder joint strength capable of withstanding industrial-grade vibrations and repetitive plug-in stress.

  • Excellent Heat Resistance & Customization: Molded with LCP or NL6T engineering plastics (UL 94V-0) for compatibility with reflow and wave soldering; customizable with Gold Flash, Gold 3U", or selective Plating Tin.

  • Mating Compatibility: Pairs perfectly with ELETE's comprehensive double-row socket range, including HFNDSH8YP, HFNDS68, HFNDM8Y, HFNDM11, HFNDM71, and more.

Drawing

Classic Applications

This 4.3mm insulator base height desigin double-row DIP pin header is widely chosen for modular multi-board architecture requiring vertical component clearance or enhanced thermal ventilation:

  • Power Supplies & Energy storage: Mezzanine stacks in power inverters, solar charge controllers, and battery management system (BMS) control cards.

  • Industrial Controls: High-clearance PLC module stacking, motor drive control units, and factory automation motherboards.

  • Telecommunications Equipment: Server sub-boards, networking router expansion bays, and rugged data communication backplanes.

  • Smart Consumer & Commercial Systems: Embedded motherboards, multi-board vending machine controls, and display controllers with tall backplane capacitors.

  • Testing & Measurement Instrumentation: Diagnostic equipment chassis, laboratory signal processing boards, and modular testing rigs.

Honorary Qualifications

ISO 9001:2015 Quality Management System Certificate (Ganzhou Dayu Factory)

ISO 9001:2015 Quality Management System Certificate (Ganzhou Dayu Factory)

ISO 9001:2015 Quality Management System Certificate

ISO 9001:2015 Quality Management System Certificate

IATF 16949:2016 Automotive Quality Management System Certificate

IATF 16949:2016 Automotive Quality Management System Certificate

TUV certification

TUV certification

TUV Certifications

TUV Certifications

arrow
arrow

Can't find the service you're looking for? Contact us!

For inquiries about our products, please send us an email. We will contact you within 24 hours.

图片名称

Technical Support

Tel: +86 13798282367
Email: yuan_guo@elete-tech.com

图片名称

Service Support

Tel: 86-769-81769832
Email: jammy.wong@elete-tech.com

We Will Contact You Within One Working Day. Please Pay Attention To Your E-mail.

%{tishi_zhanwei}%