2.54mm Pitch Dual Row Right Angle Pin Header with 4.3mm Base

Double Row Perpendicular PCB Headers with Elevated 4.3mm Housing for Critical Component Clearance

A heavy-duty 2.54mm pitch dual-row right-angle pin header engineered with an elevated 4.3mm plastic base, providing optimized physical clearance and secure perpendicular board-to-board routing.

Feature Specification
Model HMNDR43-A001
Pitch  2.54 mm / 0.1 inch / 0.1"
Gender Male Header, Pin Header
Rows Double/Dual
Insulator Heright 4.30mm
Number of Pins 2 to 40 Pins per Row
Mounting Type Right Angle Type / Through-Hole
Current Rating 3 A, 4A, 5A or as required
Insulation Resistance 1000MΩ Min
Dielectric Withstanding 600V AC
Contact Resistance 20mΩ Max
Operating Temperature -40℃ to +105℃
Contact Material Brass / Phosphor Bronze
Insulation Material High-temp Polyester,UL94V-0 LCP/NL6T/PA9T
·All materials are RoHS and REACH compliant. Halogen-free options are available.

 

Key Features & Advantage:

  • Elevated 4.3mm Base Design: The specialized 4.30mm tall plastic housing functions as an integrated standoff, delivering crucial physical clearance between parallel PCBs to safeguard taller surface-mount components from short circuits.

  • Dual-Row High Density: Combines the dual-row matrix design with standard 2.54mm spacing, optimizing multi-signal routing while maintaining high mechanical rigidity.

  • Rugged Through-Hole Mounting: The DIP pins anchor securely into the PCB holes, providing premium solder joint strength capable of withstanding industrial-grade vibrations and repetitive plug-in stress.

  • Excellent Heat Resistance & Customization: Molded with LCP or NL6T engineering plastics (UL 94V-0) for compatibility with reflow and wave soldering; customizable with Gold Flash, Gold 3U", or selective Plating Tin.

  • Mating Compatibility: Pairs perfectly with ELETE's comprehensive double-row socket range, including HFNDSH8YP, HFNDS68, HFNDM8Y, HFNDM11, HFNDM71, and more.

Drawing

Classic Applications

This industry-standard double-row DIP header is the primary backbone for electronic devices requiring heavy-duty, multi-signal vertical interfaces:

  • Industrial Automation Systems: Main logic boards for PLCs, CNC machinery controllers, and power supply backplanes.

  • Embedded & Computing Boards: Server motherboards, development kits (like Arduino/Raspberry Pi shield expansions), and peripheral modules.

  • Automotive Subsystems: Heavy-duty wire-to-board or board-to-board interfaces within ECUs, lighting controllers, and body electronics.

  • Power Supplies & Energy storage: Mezzanine connectivity in solar inverters, UPS distribution systems, and battery management boards.

  • Telecom Hardware: High-reliability routing boards within network routers, switch enclosures, and infrastructure bases.

Honorary Qualifications

ISO 9001:2015 Quality Management System Certificate (Ganzhou Dayu Factory)

ISO 9001:2015 Quality Management System Certificate (Ganzhou Dayu Factory)

ISO 9001:2015 Quality Management System Certificate

ISO 9001:2015 Quality Management System Certificate

IATF 16949:2016 Automotive Quality Management System Certificate

IATF 16949:2016 Automotive Quality Management System Certificate

TUV certification

TUV certification

TUV Certifications

TUV Certifications

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Technical Support

Tel: +86 13798282367
Email: yuan_guo@elete-tech.com

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Service Support

Tel: 86-769-81769832
Email: jammy.wong@elete-tech.com

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