2.54mm Pitch Dual Row SMT Female Header, Straight Surface Mount PCB Connector, HFNDMXX Series
Double-Row Vertical SMT PCB Socket with Multiple Profile Heights for High-Density Board-to-Board Stacking
HFNDM11-A080
Serial Number:HFNDM11-A080
A highly adaptable 2.54mm pitch dual-row vertical SMT female header featuring three configurable housing heights to precisely control vertical clearance in automated surface mount assemblies.
| Feature | Specification |
|---|---|
| Model | HFNDM11-A080 |
| Pitch | 2.54 mm / 0.1 inch / 0.1" |
| Gender | Female Header, Socket Header, Receptacle |
| Rows | Dual Rows |
| Insulator Height |
5.7mm, 8.5, 11mm HFNDM57 (H = 5.7mm) HFNDM8Y (H = 8.5mm) HFNDM11 (H = 11.0mm) |
| Number of Pins | 2 to 40 Pins per Row |
| Mounting Type | Surface Mount Technology(SMT) |
| Current Rating | 3 A, 4A, 5A or as required |
| Insulation Resistance | 1000MΩ Min |
| Dielectric Withstanding | 600V AC |
| Contact Resistance | 20mΩ Max |
| Operating Temperature | -40℃ to +105℃ |
| Contact Material | Brass / Phosphor Bronze |
| Insulation Material | High-temp Polyester,UL94V-0 LCP/NL6T/PA9T |
| ·All materials are RoHS and REACH compliant. Halogen-free options are available. | |
Key Features & Advantage
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Optimized for Automated SMT Line: Designed with flat surfaces compatible with pick-and-place nozzles. Available in Tape & Reel packaging with caps for high-speed, automated production.
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High Pin Density Capacity: The double-row layout packs up to 80 total contacts in a small space, supporting complex multi-signal routing without expanding board size.
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Reliable Dual-Beam Contacts: The dual-beam contact configuration ensures a steady wiping action and consistent retention force upon mating with male pin headers.
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Reflow Soldering Ready: Molded with advanced LCP or T-NL6T high-temperature engineered plastics to withstand high reflow temperatures without blistering or warping.
Drawing

Classic Applications
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Industrial Automation & Instrumentation: SMT-based PLC extension modules, industrial controller mainboards, and process monitoring equipment.
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Embedded & Computing Systems: Multi-tier single-board computer (SBC) extensions, microcontroller expansion shields, and processing modules.
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Telecommunications: Modular enterprise routers, high-density switches, and base station interface array cards.
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Smart Energy & Power Systems: Digital power meters, solar inverter control logic boards, and compact power management units.
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Medical Electronic Devices: Internal mainboards for diagnostic screens, laboratory analyzers, and medical monitoring systems.
Honorary Qualifications
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