2.54mm Pitch Low Profile Dual Row Female Header, DIP Type PCB Connector, HFNDS35 Series-ELETE | Professional Connector Manufacturer

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2.54mm Pitch Low Profile Dual Row Female Header, DIP Type PCB Connector, HFNDS35 Series

Ultra-Thin Double-Row Vertical PCB Female Socket, 3.5mm Housing Height for High-Density Board Stacking

HFNDS35-A032

❌️

HFNDS35-A032

Serial Number：HFNDS35-A032

Connector & Cable

Board to board connector

Female Header

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A space-saving 2.54mm pitch dual-row vertical DIP female header featuring an ultra-low 3.50mm profile, ideal for high-density, compact parallel board-to-board mating.

Feature	Specification
Model	HFNDS35-A032
Pitch	2.54 mm / 0.1 inch / 0.1"
Gender	Female Header, Socket Header, Receptacle
Rows	Dual Rows
Insulator Height	3.5mm Low Profile
Number of Pins	2 to 40 Pins per Row
Mounting Type	DIP Through-Hole
Current Rating	3 A, 4A, 5A or as required
Insulation Resistance	1000MΩ Min
Dielectric Withstanding	600V AC
Contact Resistance	20mΩ Max
Operating Temperature	-40℃ to +105℃
Contact Material	Brass / Phosphor Bronze
Insulation Material	High-temp Polyester,UL94V-0 LCP/NL6T/PA9T
Suggested Mating Pin Length	2.5mm to 3.0mm
·All materials are RoHS and REACH compliant. Halogen-free options are available.

Key Features & Advantage

Low Profile (3.50mm Height): The minimal 3.5mm housing profile significantly reduces board-to-board spacing, making it perfect for slim electronic devices and high-density stacking layouts.
High-Density Contacts: Dual-row structure supports up to 80 pins per connector, delivering maximum signal processing capacity within a highly compact PCB surface area.
Premium Phosphor Bronze Contacts: Equipped with high-quality Phosphor Bronze terminals that offer excellent elasticity, fatigue resistance, and long-term connection reliability.
Stable Through-Hole DIP Mounting: The through-hole design provides strong mechanical anchoring to the PCB, ensuring the connectors handle plug-in stress and vibration without loosening.
High Thermal Durability: Optional LCP or NL6T thermoplastic insulators endure high reflow and wave soldering temperatures without dimensional distortion.

Drawing

Classic Applications

Miniaturized IoT & Smart Devices: Compact sensors, wearable tech docks, and smart home control panels.
Handheld Devices & Instruments: Portable medical diagnostic monitors, hand-held scanners, and field testing equipment.
Embedded Modules: Low-profile microcontroller development shields, daughterboards, and extension kits.
Consumer & Communications Hardware: Slim routers, solid-state drive (SSD) test arrays, and compact media boxes.
Industrial Panel Controls: Dense multi-board industrial screens and internal control interface connections.