2.54mm Pitch Low Profile Dual Row Female Header, SMT PCB Connector, HFNDM35 Series-ELETE | Professional Connector Manufacturer

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2.54mm Pitch Low Profile Dual Row Female Header, SMT PCB Connector, HFNDM35 Series

Ultra-Thin Surface Mount Double-Row Vertical Female Socket, 3.5mm Housing Height for High-Density SMT Assemblies

HFNDM35-A072

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HFNDM35-A072

Serial Number：HFNDM35-A072

Connector & Cable

Board to board connector

Female Header

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A premium, space-saving 2.54mm pitch dual-row vertical SMT female header featuring an ultra-low 3.50mm height, engineered for automated pick-and-place assembly in low-profile board stacking designs.

Feature	Specification
Model	HFNDM35-A072
Pitch	2.54 mm / 0.1 inch / 0.1"
Gender	Female Header, Socket Header, Receptacle
Rows	Dual Rows
Insulator Height	3.5mm Low Profile
Number of Pins	2 to 40 Pins per Row
Mounting Type	S.M.T Type (Surface Mount Technology)
Current Rating	3 A, 4A, 5A or as required
Insulation Resistance	1000MΩ Min
Dielectric Withstanding	600V AC
Contact Resistance	20mΩ Max
Operating Temperature	-40℃ to +105℃
Contact Material	Brass / Phosphor Bronze
Insulation Material	High-temp Polyester,UL94V-0 LCP/NL6T/PA9T
Suggested Mating Pin Length	2.5mm to 3.0mm
·All materials are RoHS and REACH compliant. Halogen-free options are available.

Key Features & Advantage

Low Profile (3.50mm): The minimal 3.5mm footprint helps save critical vertical space, allowing for ultra-thin multi-board stacking configurations.
Automated SMT Assembly Support: Perfectly designed for high-speed Surface Mount Technology lines. Available in Tape & Reel packaging with suction caps for seamless pick-and-place integration.
High Pin Density: Double-row architecture houses up to 80 contacts in a compact surface area, maximizing signal expansion and power routing paths.
High-Quality Phosphor Bronze: Contacts offer superior resilience, anti-fatigue performance, and reliable electrical conductivity under repetitive mating cycles.
Excellent Thermal Durability: Crafted with LCP or T-NL6T high-temperature plastics to ensure stability and zero deformation during demanding lead-free reflow soldering profiles.

Drawing

Classic Applications

Smart Home & IoT Devices: Slim smart thermostats, connected gateway hubs, and compact domestic automation nodes.
Consumer & Portable Electronics: Low-profile media streaming boxes, handheld gadgets, and ultra-thin digital screen panels.
High-Density Industrial Modules: Compact SMT motor controllers, modern PLC multi-board sets, and sensory arrays.
Telecommunications: Blade server daughtercards, slim network routers, and high-frequency communication switches.
Medical Diagnostic Instrumentation: Space-saving control circuit boards in portable health monitors and laboratory scanners.