2.54mm Pitch Pin Header Dual Rows DIP Type | ELETE HMNDS Series-ELETE | Professional Connector Manufacturer

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2.54mm Pitch Pin Header Dual Rows DIP Type | ELETE HMNDS Series

High-Density Through-Hole Double Row PCB Headers with Maximum Mechanical Strength

HMNDS25-A001

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HMNDS25-A001

Serial Number：HMNDS25-A001

Connector & Cable

Board to board connector

Male Header

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A classic, high-density 2.54mm pitch dual-row through-hole pin header engineered for robust vertical board-to-board interconnects and reliable power/signal transmission.

Feature	Specification
Model	HMNDS25-A001
Pitch	2.54mm(0.1'')
Gender	Male Header, Pin Header
Rows	Double/Dual
Insulator Height	1.5mm, 2.54mm
Number of Pins	2 to 40 Pins per Row
Mounting Type	DIP Type / Through-Hole
Current Rating	3 A, 4A, 5A or as required
Insulation Resistance	1000MΩ Min
Dielectric Withstanding	600V AC
Contact Resistance	20mΩ Max
Operating Temperature	-40℃ to +105℃
Contact Material	Brass / Phosphor Bronze
Insulation Material	High-temp Polyester,UL94V-0 LCP/NL6T/PA9T
·All materials are RoHS and REACH compliant. Halogen-free options are available.

Key Features & Advantage:

Double Row High-Density: 2.54mm dual-row configuration allows for double the signal or power density within a compact footprint compared to single-row variants.
Superior Mechanical Durability: The DIP (through-hole) mounting style provides exceptionally strong solder retention to the PCB, making it highly resilient to mechanical stress and repetitive mating cycles.
Versatile Material Selections: Offers customizable insulation heights in LCP or NL6T high-temperature materials, paired with Brass or Phosphor Bronze pins for superior customizability.
Comprehensive Mating Ecosystem: Universally compatible with an extensive range of ELETE female sockets, such as HFNDSH8YP, HFNDS68, HFNDM8Y, HFNDM11, HFNDM71, HFNDT71, HFNDT50, and more.
Fully Compliant & Eco-friendly: Meets 100% RoHS & REACH safety standards, with optional Halogen-free grades to accommodate green manufacturing requirements worldwide.

Drawing

Classic Applications

This industry-standard double-row DIP header is the primary backbone for electronic devices requiring heavy-duty, multi-signal vertical interfaces:

Industrial Automation Systems: Main logic boards for PLCs, CNC machinery controllers, and power supply backplanes.
Embedded & Computing Boards: Server motherboards, development kits (like Arduino/Raspberry Pi shield expansions), and peripheral modules.
Automotive Subsystems: Heavy-duty wire-to-board or board-to-board interfaces within ECUs, lighting controllers, and body electronics.
Power Supplies & Energy storage: Mezzanine connectivity in solar inverters, UPS distribution systems, and battery management boards.
Telecom Hardware: High-reliability routing boards within network routers, switch enclosures, and infrastructure bases.