2.54mm Pitch Single Row Bottom Entry SMT Female Header - ELETE HFNSTXX Series-ELETE | Professional Connector Manufacturer

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2.54mm Pitch Single Row Bottom Entry SMT Female Header - ELETE HFNSTXX Series

3.0A Surface Mount Bottom-Entry PCB Socket, SV/SN Dual Solder Pad Layouts, 2-40 Pins

HFNST50-T001

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HFNST50-T001

Serial Number：HFNST50-T001

Connector & Cable

Board to board connector

Female Header

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ELETE HFNSTXX 2.54mm bottom-entry SMT female headers allow mating pins to enter from the underside of the PCB. Features 3.0A current rating, variable profile heights (3.5/5.0/7.1mm), and rugged phosphor bronze contacts.

Feature	Specification
Model	HFNST50-T001
Pitch	2.54 mm / 0.1 inch / 0.1"
Gender	Female Header, Socket Header, Receptacle
Rows	Single Row
Insulator Heright	3.5mm, 5.0mm, 7.1mm
Number of Pins	2 to 40 Pins per Row
Mounting Type	DIP, Straight Type
Current Rating	3 A, 4A, 5A or as required
Insulation Resistance	1000MΩ Min
Dielectric Withstanding	600V AC
Contact Resistance	20mΩ Max
Operating Temperature	-40℃ to +105℃
Contact Material	Brass / Phosphor Bronze
Insulation Material	High-temp Polyester,UL94V-0 LCP/NL6T/PA9T
Suggested Mating Pin Length	4.0mm to 6.0mm
·All materials are RoHS and REACH compliant. Halogen-free options are available.

Key Features & Advantage

Innovative Bottom-Entry Architecture: Specially engineered to allow mating pins to pass through the PCB from the bottom side, providing a perfect solution for unique pass-through stacked board architectures and inverted mounting.
Flexible SV/SN SMT Footprints: Offers SV (single-side pitch alignment) and SN (dual-side interleaved pads) SMT patterns to match various surface-mount density and PCB tracing requirements perfectly.
Multiple Profile Options: Available in three different plastic insulator heights (H=3.5mm, 5.0mm, 7.1mm) via HFNST35, HFNST50, and HFNST71 to easily tailor vertical clearance requirements.
Excellent Fatigue-Resistant Contacts: Built with high-performance Phosphor Bronze terminals, ensuring stable normal force, a 3.0A current rating, and exceptional contact durability.
Reflow Process Ready: Molded from heat-resistant LCP or NL6T materials (UL 94V-0) to seamlessly withstand automated high-temperature lead-free reflow soldering profiles up to 260°C.

Drawing

Classic Applications

Multi-Layer Stacked Systems: Embedded daughterboards, sandwich-style PCB designs, and PC104-like ruggedized stacking computing systems.
LED Systems & Backlighting: SMT backplane connections where power/signal pins must feed discreetly through from the bottom of the lighting substrate.
Industrial Automation Modules: Pass-through communication modules, DIN-rail mounted control boards, and multi-layered sensor arrays.
Power Supplies & Energy Converters: Power monitoring sub-boards, inverter controls, and heavy-duty SMT multi-board power paths.
Smart Home & Appliance Gateways: Compact main control hubs requiring smart vertical stacking to minimize overall device thickness.