2.54mm x 2.54mm 3-Row Right Angle Female Header DIP PCB Board-to-Board Connector

High-Density Triple-Row Right Angle Through-Hole Female Header for Space-Saving Side-by-Side PCB Mating

HFNTR8Y series is a 2.54mm pitch, triple-row right-angle through-hole female header designed to achieve ultra-high pin density and reliable coplanar or perpendicular PCB connections in space-constrained layouts.

Feature Specification
Model HFNTR8Y-A001
Pitch  2.54 mm / 0.1 inch / 0.1"
Gender Female Header, Socket Header, Receptacle
Rows Triple Row (3 Rows)
Insulator Height

8.5mm

Number of Pins 2 to 40 Pins per Row
Mounting Type R/A, Right Angle(90-Degree)
Current Rating 3 A, 4A, 5A or as required
Insulation Resistance 1000MΩ Min
Dielectric Withstanding 600V AC
Contact Resistance 20mΩ Max
Operating Temperature -40℃ to +105℃
Contact Material Brass / Phosphor Bronze
Insulation Material High-temp Polyester,UL94V-0 LCP/NL6T/PA9T
Suggested Mating Pin Length 4.0mm to 6.0mm
·All materials are RoHS and REACH compliant. Halogen-free options are available.

 

Key Features & Advantage

  • High-Density Triple Row Layout: Features a three-row configuration that drastically increases the overall pin-count capacity within a compact footprint, streamlining complex multi-channel routing.

  • Excellent Mechanical Stability: The DIP (through-hole) mounting style ensures exceptionally strong retention forces on the PCB, providing durable protection against high-mating-cycle wear and physical stress.

  • Thermal-Resistant Engineering Materials: Constructed from high-temperature LCP or NL6T materials (UL 94V-0 rated), perfectly matching lead-free wave soldering profiles.

  • Robust Electrical Transmission: Capable of a 3.0 Amp current rating per contact and a high insulation resistance of 1000MΩ Min, keeping signal crossovers low and signal integrity high.

  • Flexible Product Stacking Configuration: Offers a wide range of positions from 2 to 40 pins per row (total up to 120 pins), with customizable pin lengths and various finishing platings (Gold Flash, 3U" Gold, Tin, Select Plating).

Drawing

Drawing

Classic Applications

  • Industrial Communication & Automation: Industrial servers, expansion daughterboards, modular PLC interfaces, and backplane control systems.

  • Telecommunications & Networking: High-capacity network switchboard panels, routers, peripheral hardware rack ears, and base stations.

  • Data Storage & Computing: Mass data servers, embedded motherboard arrays, and modular drive array controllers.

  • Power Electronics & Inverters: Centralized power controls, distribution hub panels, and solar power multi-channel tracking controllers.

  • Medical Diagnostic Instrumentation: Medical computing backplanes, image processing modules, and complex multi-parameter laboratory analysis hardware.

Honorary Qualifications

ISO 9001:2015 Quality Management System Certificate (Ganzhou Dayu Factory)

ISO 9001:2015 Quality Management System Certificate (Ganzhou Dayu Factory)

ISO 9001:2015 Quality Management System Certificate

ISO 9001:2015 Quality Management System Certificate

IATF 16949:2016 Automotive Quality Management System Certificate

IATF 16949:2016 Automotive Quality Management System Certificate

TUV certification

TUV certification

TUV Certifications

TUV Certifications

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Technical Support

Tel: +86 13798282367
Email: yuan_guo@elete-tech.com

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Tel: 86-769-81769832
Email: jammy.wong@elete-tech.com

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