2.54mm x 2.54mm Dual Row Vertical SMT Female Header PCB Connector (11mm High Profile)
High-Reliability Four-Point Contact Surface Mount (SMT) Female Header with 11mm Elevated Insulator Height
HFNDM11-A001
Serial Number:HFNDM11-A001
HFNDM11 series is a 2.54mm pitch, dual-row vertical SMT female header featuring an elevated 11.00mm profile and a high-reliability four-point contact design, engineered for high-clearance surface-mount board-to-board configurations.
| Feature | Specification |
|---|---|
| Model | HFNDM11-A001 |
| Pitch | 2.54mm(0.1'') |
| Gender | Female Header, Socket Header, Receptacle |
| Special Design | Four-Point Contacts |
| Rows | Dual Row |
| Insulator Height |
11mm |
| Number of Pins | 2 to 40 Pins per Row |
| Mounting Type | SMT / Surface Mount (Vertical) |
| Current Rating | 3 A, 4A, 5A or as required |
| Insulation Resistance | 1000MΩ Min |
| Dielectric Withstanding | 600V AC |
| Contact Resistance | 20mΩ Max |
| Operating Temperature | -40℃ to +105℃ |
| Contact Material | Brass / Phosphor Bronze |
| Insulation Material | High-temp Polyester,UL94V-0 LCP/NL6T/PA9T |
| ·All materials are RoHS and REACH compliant. Halogen-free options are available. | |
Key Features & Advantage
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Ultimate Four-Point Contact Reliability: Utilizes an advanced four-point contact structure to deliver stable grid pressure and low contact resistance, ensuring uninterrupted signal and power transmission against heavy mechanical shock and vibration.
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11.00mm High-Profile Clearance: The extra-tall 11.00mm insulator height provides substantial vertical clearance between stacked PCBs, allowing optimal thermal dissipation, improved airflow, and ample space for underlying components.
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High-Temperature SMT Housing: Molded from premium, UL 94V-0 rated LCP or NL6T materials, enabling the connector to safely withstand the rigorous thermal profiles of lead-free reflow soldering.
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Optimized for Automated SMT Assembly: Features strict co-planarity controls (0.15mm Max) and is available with a pick-and-place cap in Tape & Reel packaging for smooth, continuous high-speed factory automation.
Drawing
Classic Applications
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Multi-layer Industrial Stacking: Heavy-duty automation control panels, modular PLC systems, and robust multi-board electronic architectures.
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Power Management Systems: Solar inverters, smart grid equipment, industrial power supplies, and DC-DC converters where airflow and thermal management are vital.
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Telecom & High-Speed Networking: Outdoor communication base stations, embedded rack servers, and high-density networking hubs.
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Advanced Medical Equipment: Clinical laboratory testing instruments, critical patient monitoring electronics, and diagnostic imaging internal systems.
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Rugged Automotive Control: In-vehicle tracking hardware, telematics modules, and dashboard control units requiring vibration-proof surface mount components.
Honorary Qualifications
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