Solderless Press-Fit pin for Automotive SiC & IGBT Power Modules-ELETE | Professional Connector Manufacturer

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Solderless Press-Fit pin for Automotive SiC & IGBT Power Modules

Low-Profile Press-Fit Terminal for IGBT/SiC

TYZ101-044

❌️

TYZ101-044

Serial Number：TYZ101-044

High-precision Press-Fit Pin Receptacles with multiple thickness options (0.4mm/0.5mm/0.64mm) and customizable plating for secure, solderless PCB electronic manufacturing.

Feature	Specification
Material	Phosphor Bronze (C5191/C19010/18150/T2), or Custom
Thickness	0.4mm,0.5mm,0.64mm
Applicable PCB Hole Dia.	φ0.4mm~φ1.0mm
Plating Options	Gold/Silver/Tin/ Indium
Insertion Force	Max. 80N per pin
Retention Force	Min. 20N per pin
Current Rating	Up to 5A - 10A (Depending on design)
Operating Temp	Operating Temp
Compliance	RoHS, REACH, ISO9001, IATF16949
·All materials are RoHS and REACH compliant. Halogen-free options are available.

Key Features & Advantages

Low-Profile Architecture – 5.89mm total height, reduces module volume.
2-Piece Stress-Decoupling – Absorbs CTE mismatch in IGBT/SiC power stages.
Widened Stop Flange – 1.30mm shoulder for secure overmolding positioning.
0.40mm Compliant Zone – Micro-gauge, gas-tight insertion into fine-line PCBs.
Full-Body Plating – Uniform Au (or Ag/Sn/In) for conductivity & fretting corrosion resistance.

Drawing

Classic Applications

ELETE TYZ101-043 is a 5.89mm low-profile 2-piece assembled press-fit terminal for IGBT modules, purpose-built to deliver superior solderless and thermal-stress-relieved connections for next-generation ultra-thin, high-power-density EV inverters and SiC semiconductors.

⚡ Next-Gen Compact EV Traction Inverters
• 🔌 Serving as the low-profile gate-drive and control link pins within slim-profile silicon carbide (SiC) MOSFET modules or next-gen ultra-thin IGBT stacks.

🔌 High-Density Automotive IPM Modules
• 🔋 Embedded in highly integrated intelligent power modules where vertical workspace is extremely restricted.

💧 Liquid-Cooled EV Power Distribution Units (PDU)
• ❄️ Interfacing sensitive driver electronic layers directly positioned right above cooling jackets and thermal baseplates.

Honorary Qualifications