Z-Offset Straight Dual Press-Fit Pin with U-Slot Busbar Terminal
Heavy-duty Z-offset dual press-fit terminal with a U-slot for misaligned PCB-to-busbar power mating
Solderless Gas-Tight Reliability: Completely eliminates cold joints and thermal stress from manual soldering, achieving a reliable, vibration-proof, gas-tight interconnection ideal for harsh automotive standards.
| Feature | Specification |
|---|---|
| Material | Phosphor Bronze (C5191/C19010/18150/T2), or Custom |
| Thickness | 0.8mm |
| Applicable PCB Hole Dia. | φ0.8mm~φ1.0mm |
| Plating Options | Gold/Silver/Tin/ Indium |
| Insertion Force | Max. 80N per pin |
| Retention Force | Min. 20N per pin |
| Current Rating | Up to 5A - 10A (Depending on design) |
| Operating Temp | Operating Temp |
| Compliance | RoHS, REACH, ISO9001, IATF16949 |
| ·All materials are RoHS and REACH compliant. Halogen-free options are available. | |
Key Features & Advantages
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Z-Offset Profile – Bridges misaligned PCBs and busbars.
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2.54mm Dual Press-Fit – Twin fish-eye pins for double current & anti-twist.
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Multi-Layer Retention – 5.50mm locking grooves for pull-out resistance.
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Tuning Fork Interface – 5.50x6.50mm U-slot, zero vibration looseness.
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Solderless Connection – Gas-tight, no thermal defects or cleaning.
Drawing

Classic Applications
High-current dual press-fit compliant pin featuring a Z-shape offset profile and retention locking grooves, specifically engineered to bridge PCBs and busbars with slight height variations or misalignment.
🔋 EV Battery Modules & Pack BMS – Power bridging when monitoring PCB and cell busbars have minor layout offset.
📦 Compact PDU & Junction Boxes – Direct insertion from multi-tiered power grids to control boards.
⚡ Power Electronics & IGBT Inverters – Interconnecting multi-layer bus systems or DC-link capacitors to driving circuits in tight enclosures.
🏭 Industrial Automation Grids – Heavy-current interface for rack-mounted modular components with structural tolerances.
Honorary Qualifications
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