2.54mm Pitch Pin Header Dual Rows SMT Type | ELETE HMNDM Series

Standard Double Row Surface Mount PCB Headers for High-Speed Automated Assembly

An industry-standard 2.54mm pitch dual-row SMT pin header with a 2.54mm base, delivering high-density, low-profile vertical board-to-board connections for automated volume production.

Feature Specification
Model HMNDM25-A001
Pitch  2.54 mm / 0.1 inch / 0.1"
Gender Male Header, Pin Header
Rows Double/Dual
Insulator Height 1.50mm,2.54mm
Number of Pins 2 to 40 Pins per Row
Mounting Type S.M.T Type
Current Rating 3 A, 4A, 5A or as required
Insulation Resistance 1000MΩ Min
Dielectric Withstanding 600V AC
Contact Resistance 20mΩ Max
Operating Temperature -40℃ to +105℃
Contact Material Brass / Phosphor Bronze
Insulation Material High-temp Polyester,UL94V-0 LCP/NL6T/PA9T
·All materials are RoHS and REACH compliant. Halogen-free options are available.

 

Key Features & Advantage:

  • High-Density Surface Mount: 2.54mm double-row layout maximizes I/O channels in a minimized surface area. SMT design eliminates through-holes, freeing up the opposite side of the PCB for dense layout routing.

  • Precision Gull-Wing SMT Leads: Formed with high-precision symmetric gull-wing pins to support strict coplanarity within 0.15mm Max. , ensuring robust solder joint integration and fast AOI inspection.

  • Reflow Profile Compatible: Injection-molded using high-temperature LCP or NL6T engineering plastic (UL 94V-0), guaranteeing zero deformation during demanding lead-free reflow soldering processes.

  • Fully Ready for High-Speed Automation: Can be supplied in Tape & Reel with Cap packaging, facilitating seamless pick-and-place operation to reduce manufacturing time and labor overhead.

  • Universal Mating Compatibility: Universally mates with ELETE’s comprehensive double-row socket range, including HFNDSH8YP, HFNDS68, HFNDM8Y, HFNDM11, HFNDM71, HFNDT71, and HFNDMH8YP.

Drawing

Classic Applications

This standard double-row SMT pin header is the ubiquitous interconnection choice across countless automated electronic assemblies requiring reliable, high-density mezzanine integration:

  • Smart Home & IoT Devices: Smart gateways, central control hubs, security panels, and connected home appliance modules.

  • Industrial Automation & Embedded Computing: Main boards for PLCs, single-board computers (SBC), industrial HMI panels, and I/O daughter-cards.

  • Consumer Electronics & Displays: High-end audio systems, smart TVs, digital projectors, and commercial printing control boards.

  • Telecommunications & Networking: Data routing sub-boards within enterprise switches, wireless routers, and server blade systems.

  • Automotive Infotainment & Electronics: Connected dashboards, sensor integration modules, and dual-board electronic subsystems.

Honorary Qualifications

ISO 9001:2015 Quality Management System Certificate (Ganzhou Dayu Factory)

ISO 9001:2015 Quality Management System Certificate (Ganzhou Dayu Factory)

ISO 9001:2015 Quality Management System Certificate

ISO 9001:2015 Quality Management System Certificate

IATF 16949:2016 Automotive Quality Management System Certificate

IATF 16949:2016 Automotive Quality Management System Certificate

TUV certification

TUV certification

TUV Certifications

TUV Certifications

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Tel: +86 13798282367
Email: yuan_guo@elete-tech.com

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