2.54mm Pitch Dual Row SMT Pin Header with 4.3mm Base | ELETE HMNDM43 Series-ELETE

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2.54mm Pitch Dual Row SMT Pin Header with 4.3mm Base | ELETE HMNDM43 Series

Surface Mount Double Row Stacking Headers with Elevated 4.3mm Housing for Automated PCB Assembly

HMNDM43-A001

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HMNDM43-A001

Serial Number：HMNDM43-A001

Connector & Cable

Board to board connector

Male Header

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A high-precision 2.54mm pitch dual-row SMT pin header designed with an elevated 4.3mm base, combining space-saving surface mount efficiency with reliable vertical board-to-board spacing.

Feature	Specification
Model	HMNDM43-A001
Pitch	2.54 mm / 0.1 inch / 0.1"
Gender	Male Header, Pin Header
Rows	Double/Dual
Insulator Height	4.30mm
Number of Pins	2 to 40 Pins per Row
Mounting Type	S.M.T Type
Current Rating	3 A, 4A, 5A or as required
Insulation Resistance	1000MΩ Min
Dielectric Withstanding	600V AC
Contact Resistance	20mΩ Max
Operating Temperature	-40℃ to +105℃
Contact Material	Brass / Phosphor Bronze
Insulation Material	High-temp Polyester,UL94V-0 LCP/NL6T/PA9T
·All materials are RoHS and REACH compliant. Halogen-free options are available.

Key Features & Advantage:

Integrated 4.3mm Elevated Standoff: The fixed 4.30mm tall plastic housing functions as a built-in physical standoff, creating vital clearance between parallel PCBs to safeguard delicate SMD components from compression or short circuits.
High-Efficiency SMT Footprint: Utilizes surface mount technology to eliminate the need for through-hole drilling, dramatically optimization bottom-layer circuit routing space. It supports strict coplanarity control within 0.15mm Max. for clean, error-free soldering.
Double Row Matrix: Employs a standard 2.54mm dual-row spacing that doubles your layout's data and power delivery capacity within a highly compressed mechanical footprint.
Reflow Soldering Ready: Injection molded from top-tier LCP or NL6T engineering thermoplastics (UL 94V-0), guaranteeing absolute stability and structural retention during high-temperature lead-free reflow processes.
Fully Automated Packaging Options: Available in Tape & Reel with Cap or Tube packaging, designed specifically for rapid pick-and-place processing to lower overall assembly costs.
Comprehensive Mating Matrix: Universally matches ELETE's double-row female receptacle lines, including HFNDSH8YP, HFNDS68, HFNDM8Y, HFNDM11, HFNDM71, HFNDT71, and HFNDMH8YP.

Drawing

Classic Applications

This elevated double-row SMT pin header is the premium choice for advanced high-density multi-board nesting and mezzanine stacking that requires strict component clearance and automated assembly:

IoT Infrastructure & Gateways: Stacked sensor sub-boards, smart communication hubs, and environmental tracking arrays.
Industrial Automation & Embedded Systems: High-clearance PLC module stacks, compact motor controllers, and modular computing expansion cards.
Power & Energy Management: Micro-inverter control cards, solar power distribution regulators, and compact battery management systems (BMS).
Automotive Tech & Infotainment: Dual-layer PCB integration inside smart dashboards, advanced driver-assistance modules (ADAS), and interior lighting control systems.
Telecommunications & Computing Hardware: Mezzanine daughter-cards within server blades, high-speed network switches, and compact wireless base station units.